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NEXUS Workshop for upcoming EU Call on Micro und Nanosystems

9th May 2007

Munich, Germany.  SENSOR+TEST Exhibition 2007 will play host to a NEXUS workshop for both visitors and exhibit participants on „Finding Partners for EU-Projects in MST/ MEMS".  In collaboration with WTC, the workshop provides practical information concerning the upcoming EU call in Autumn 2007. 

Many small and medium size companies face a common problem: "We would like to join EU projects but it is hard to find projects or the best-suited partners". In particular, SMEs often address niche applications that are either not very attractive for larger companies, or even unknown. 

The upcoming EU call for Micro and Nanosystems is an opportunity to address niche and volume applications in the areas of: 

The new NEXUS workshop presents the upcoming topics of R&D supported by the EU Commission in the 7th Framework programme. 

Invited companies and research institutes will present project ideas and request-for-partners at the
half-day event, at which time attendees can meet the project leaders and present their interests in participation.

Event details:

Title:                     Finding Partners für EU-Projekts in MST/MEMS

Host:                     The Nexus Association, Neuchâtel (CH)

Date:                     23rd May 2007

Start:                     2 p.m.

Venue:                 Nürnberg, CCN Ost, Level 2

Room:                  „Kopenhagen"

Your attendance is free, however space is limited. Please register online at: www.nexus-mems.com/workshop2007

Agenda: „Finding Partners for EU-Projekts in MST/MEMS" 

.00

Welcome

Nexus

14.05

Changes in the MEMS industry

Dr. Henning Wicht, WTC

14.20

FP 7 context, topics and calls for Micro & Nanotech

EU

14.45

Nexus today

Sean Neylon, Nexus

15.00

Partners in New Member States (Eastern Europe)

Dan Dascalu, Int. Istitute of R&D in Microtechnology (IMT)

15.20

Cluster Microsystem Technology - objectives and tasks

Prof. H. Gesch,  FH Landshut / Cluster Mikrosystemtechnik

15.45

coffee break  

 

16.15

Experience from providing foundry services in Europe

Dirk Enderlein, HL Planar

16.30

Position Sensing Systems using N-dimensional Hall-Sensors

Josef Sauerer, Fraunhofer Institute for Integrated Circuits (IIS)

16.45

Perspective of LTCC technology for system in package and MEMS packaging

Franz Bechtold, Via Electronics

17.00

Summary and conclusion

Dr. Henning Wicht, WTC

17.30

Get together

 


Press release as PDF file.