Home » News » Press releases
9th May 2007
Munich, Germany. SENSOR+TEST Exhibition 2007 will play host to a NEXUS workshop for both visitors and exhibit participants on „Finding Partners for EU-Projects in MST/ MEMS". In collaboration with WTC, the workshop provides practical information concerning the upcoming EU call in Autumn 2007.
Many small and medium size companies face a common problem: "We would like to join EU projects but it is hard to find projects or the best-suited partners". In particular, SMEs often address niche applications that are either not very attractive for larger companies, or even unknown.
The upcoming EU call for Micro and Nanosystems is an opportunity to address niche and volume applications in the areas of:
The new NEXUS workshop presents the upcoming topics of R&D supported by the EU Commission in the 7th Framework programme.
Invited companies and research institutes will present
project ideas and request-for-partners at the
half-day event, at which time attendees can meet the project leaders and
present their interests in participation.
Event details:
Title: Finding Partners für EU-Projekts in MST/MEMS
Host: The Nexus Association, Neuchâtel (CH)
Date: 23rd May 2007
Start: 2 p.m.
Venue: Nürnberg, CCN Ost, Level 2
Room: „Kopenhagen"
Your attendance is free, however space is limited. Please register online at: www.nexus-mems.com/workshop2007
Agenda: „Finding Partners for EU-Projekts in MST/MEMS"|
.00 |
Welcome |
Nexus |
|
14.05 |
Changes in the MEMS industry |
Dr. Henning Wicht, WTC |
|
14.20 |
FP 7 context, topics and calls for Micro & Nanotech |
EU |
|
14.45 |
Nexus today |
Sean Neylon, Nexus |
|
15.00 |
Partners in New Member States (Eastern Europe) |
Dan Dascalu, Int. Istitute of R&D in Microtechnology (IMT) |
|
15.20 |
Cluster Microsystem Technology - objectives and tasks |
Prof. H. Gesch, FH Landshut / Cluster Mikrosystemtechnik |
|
15.45 |
coffee break |
|
|
16.15 |
Experience from providing foundry services in Europe |
Dirk Enderlein, HL Planar |
|
16.30 |
Position Sensing Systems using N-dimensional Hall-Sensors |
Josef Sauerer, Fraunhofer Institute for Integrated Circuits (IIS) |
|
16.45 |
Perspective of LTCC technology for system in package and MEMS packaging |
Franz Bechtold, Via Electronics |
|
17.00 |
Summary and conclusion |
Dr. Henning Wicht, WTC |
|
17.30 |
Get together |
|
Press release as PDF file.